RF-BM-S01 is a Bluetooth Low Energy (BLE) module based on TI CC2540F256, an 8051 core BLE System-on-Chip (SoC). This PCB integrates a 32 MHz crystal, a 32.768 kHz crystal, an LC balun, an RF matching filter, and a meander line PCB antenna. It is pre-programmed with the BLE 4.0 stack and an application communication protocol over its full-speed USB interface. It can be used to design a USB dongle to easily establish BLE connection from a device to smart phone. Very low-power sleep modes are available. Short transition times between operating modes further enable low power consumption. RF-BM-S01 is pin-compatible with the RF-BM-S01A in the SMT package, if the USB is not used on the RF-BM-S01 and the I2C/extra I/O is not used on the RF-BM-S01A. Compared to the RF-BM-S01, the RF-BM-S01A provides lower RF current consumption. The RF-BM-S01A does not have the USB interface of the RF-BM-S01 and provides lower maximum output power in TX mode. The RF-BM-S01A also adds a HW I2C interface.
Parameters of RF-BM-S01
Chipset | CC2540F256 |
Supply Power Voltage | 2.0 V ~ 3.6 V, recommended to 3.3 V |
Frequency | 2402 MHz ~ 2480 MHz |
Transmit Power | Programmable: -23.0 dBm ~ +4.0 dBm |
Receiving Sensitivity (low gain mode) | -87 dBm |
Receiving Sensitivity (high gain mode) | -93 dBm |
GPIO | 19 |
Crystal | 32 MHz, 32.768 kHz |
RAM | 8 KB |
Flash | 256 KB |
Package | SMT Packaging |
Frequency Error | ±20 kHz |
Dimension | 17.4 mm x 13.7 mm x (1.7 ± 0.1) mm |
Type of Antenna | PCB Antenna |
Operating Temperature | -40 ℃～ +85 ℃ |
Storage Temperature | -40 ℃～ +125 ℃ |
RX Current | 19.6 mA |
TX Current (-6 dBm) | 24.0 mA |
Power mode 1 (3-μs wake-up) | 235 μA |
Power mode 2 (sleep timer on) | 0.9 μA |
Power mode 3 (external interrupts) | 0.4 μA |
